Driver Safety and Automation
Driver Safety and Automation
Product Line

Customized Packages

Patrice Dionne

Product Line Manager

indie has more than a decade of experience in the design, integration, characterization and mass production of custom photonic modules for a broad range of applications.

We routinely package an extensive range of photonic components, such as semiconductor laser diodes, PICs, SOAs, photodiodes, filters, and modulators within fiber coupled packages to create custom optical engines for our customers. Industry standard butterfly packages can be used as well as custom packages and enclosures. We can also integrate high performance laser control electronics for frequency and phase locking.

indie’s state-of-the-art hybrid packaging allows us to co-develop robust, cost-optimized, ultra-compact integrated photonics solutions for our customers.

Why Partner with indie for Your Development Success?

  • World Class photonic integration capabilities offering precise alignment of DFB laser diodes, SOAs, PICs, FBGs and optical fiber.
  • >10 years experience in chip design and dozens of silicon photonic (SiP) and InP wafer runs.
  • High throughput test and burn in stations for volume production.
  • Experts in low noise laser drive and control electronics.
  • Telcordia proven robust packaging with high coupling efficiency and best-in-class thermal management.
  • An agile, innovative approach from proof-of-concept to volume production.

Packaging Capabilities: Examples


Multi-wavelength RFOG
3 phase-locked narrow-linewidth DFB laser diodes, SiP chip for light mixing, phase control and master-slave locking interactions, FBG frequency discriminator, piezo-electric modulators, isolator and coupling optics.
FMCW LiDAR multi-channel coherent detection engine
Co-packaging of intrinsically narrow-linewidth DFB laser diodes, semi-conductor optical amplifiers (SOAs), SiP chip for light mixing and detection, circulators, isolator and coupling optics.

Key Features and Benefits

High Performance Photonics and Electronics:
High power & narrow-linewidth DFB laser diodes, high power SOAs, elaborated PIC, low noise drive electronics, etc.

Ultra-Compact and Stable:
Compact packaging with high coupling efficiency and best-in-class thermal management.

Agility and Innovation:
Customer driven approach, extensive support from the proof-of-concept ideation up to the transfer into production.

Cost Optimization:
Our vision is to optimize system cost by gathering multiple functions within a single package.